PART |
Description |
Maker |
21-0137 |
PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3*3*0.80MM
|
Maxim Integrated Products
|
21-0102 |
PACKAGE OUTLINE, 12,16L QFN, 3x3x0.90 MM
|
Dallas Semiconducotr Dallas Semiconductor
|
AP2311GN-HF AP2311GN-HF-14 |
1.8 A, 60 V, 0.25 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp. Advanced Power Electronics ...
|
AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp. Advanced Power Electron...
|
AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp.
|
AP2305GN-HF AP2305GN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp. Advanced Power Electron...
|
TO92 |
Through hole, 3 pin package Package outline
|
Zetex Semiconductors
|
SOT684-2 |
Package outline
|
NXP Semiconductors PHILIPS[Philips Semiconductors]
|
SOT23-6 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP2X2-4 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP8X7-56 |
Package Outline
|
Global Mixed-mode Techn...
|